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Higashiosaka, Japan

Koichi Yoshida

USPTO Granted Patents = 9

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 108(Granted Patents)

Location History:

Kawasaki, JP (1995)
Higashi-Osaka, JP (1999 - 2008)

Company Filing History:

9 out of 27,375

Matsushita Electric Industrial Co., Ltd.

Years Active: 1995-2008

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7350684 - Apparatus and method for forming bump (2008-04-01),

2. 6910613 - Device and method for forming bump (2005-06-28),

3. 6481616 - Bump bonding device and bump bonding method (2002-11-19),

4. 6328196 - Bump bonding device and bump bonding method (2001-12-11),

5. 6052893 - Process for manufacturing a resin-encapsulated electronic product (2000-04-25),

6. 6017812 - Bump bonding method and bump bonding apparatus (2000-01-25),

7. 5899375 - Bump bonder with a discard bonding area (1999-05-04),

8. 5858481 - Electronic circuit substrate (1999-01-12),

9. 5424907 - Solid electrolytic capacitors and method for manufacturing the same (1995-06-13),

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