The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2002
Filed:
Oct. 17, 2001
Makoto Imanishi, Neyagawa, JP;
Akihiro Yamamoto, Kobe, JP;
Hiroyuki Otani, Ikoma, JP;
Shinzo Eguchi, Kyotanabe, JP;
Takahiro Yonezawa, Neyagawa, JP;
Kazushi Higashi, Kadoma, JP;
Koichi Yoshida, Higashiosaka, JP;
Kouji Hirotani, Osaka, JP;
Matsushita Electric Industrial Co. Ltd., Osaka, JP;
Abstract
To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate