Company Filing History:
Years Active: 2001-2002
Title: Innovator Kouji Hirotani: Pioneering Advances in Bump Bonding Technologies
Introduction
Kouji Hirotani is an accomplished inventor based in Osaka, Japan, known for his significant contributions to the field of electronic part bonding. With a total of two patents to his name, Hirotani has made strides in enhancing the reliability of electronic components through innovative bonding techniques.
Latest Patents
Hirotani's latest patents focus on bump bonding devices and methods designed to eliminate breakage of electronic parts or defective bonding. The main goal of these inventions is to improve the reliability of electronic components by implementing an advanced regulation system for electronic parts within the bump bonding device. His patented bump bonding device comprises a stage for mounting and heating electronic parts, and a position regulating device that includes a rotatable regulating plate for accurate positioning. Additionally, the device features a plate that collaborates with the regulating plate and a regulating spring to ensure a secure press fit of the electronic part to the plate.
Career Highlights
Kouji Hirotani is an integral member of Matsushita Electric Industrial Co., Ltd., a company renowned for its innovation in electronic technologies. His work has not only contributed to the development of sophisticated electronic components but also played a crucial role in advancing manufacturing reliability standards in the industry.
Collaborations
Throughout his career, Hirotani has collaborated with talented coworkers such as Makoto Imanishi and Akihiro Yamamoto. These partnerships have fostered a creative environment that encourages innovation and the continuous development of cutting-edge technologies within the electronic components sector.
Conclusion
Kouji Hirotani's impressive portfolio of patents and his work with Matsushita Electric Industrial Co., Ltd. reflect his dedication to innovation in the field of electronics. His advancements in bump bonding devices exemplify the kind of ingenuity that drives the industry forward, ensuring the creation of reliable, high-performance electronic parts for various applications.