The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1999
Filed:
Sep. 24, 1997
Koichi Yoshida, Higashi-Osaka, JP;
Akihiro Yamamoto, Kobe, JP;
Takahiro Yonezawa, Neyagawa, JP;
Makoto Imanishi, Neyagawa, JP;
Abstract
The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.