The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Apr. 26, 2005
Shoriki Narita, Hirakata, JP;
Koichi Yoshida, Higashiosaka, JP;
Masahiko Ikeya, Sakai, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Makoto Imanishi, Neyagawa, JP;
Kazushi Higashi, Neyagawa, JP;
Kenji Fukumoto, Hirakata, JP;
Hiroshi Wada, Osaka, JP;
Shoriki Narita, Hirakata, JP;
Koichi Yoshida, Higashiosaka, JP;
Masahiko Ikeya, Sakai, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Makoto Imanishi, Neyagawa, JP;
Kazushi Higashi, Neyagawa, JP;
Kenji Fukumoto, Hirakata, JP;
Hiroshi Wada, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A preheat device () is provided to execute, before forming bumps () to electrode parts (), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage () through controlling the heating by a controller ().