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Kashihara, Japan

Shinji Kanayama

USPTO Granted Patents = 47 (Patent Applications = 1)

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 5.7

ph-index = 10

Forward Citations = 626(Granted Patents)

Location History:

Kajiwara, JP (2000)
Nara-ken, JP (2001)
Nara-ken., JP (2002)
Nara, JP (2002 - 2004)
Kashihara, JP (1995 - 2011)

Company Filing History:

42 out of 27,375

Matsushita Electric Industrial Co., Ltd.

5 out of 16,453

Panasonic Corporation

Years Active: 1995-2011

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Areas of Expertise:

Component Mounting

Bump Formation

Ultrasonic Bonding

Semiconductor Wafer

Charge Appearance Substrate

Frictional Connection

Bump Bonding

Electronic Component

IC Chip Packaging

Suction Holding

Linear Actuation

Terminal Component Bonding

47 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7861908 - Component mounting method, component mounting apparatus, and ultrasonic bonding head (2011-01-04),

2. 7827677 - Component mounting apparatus (2010-11-09),

3. 7797820 - Component mounting apparatus (2010-09-21),

4. 7549567 - Component mounting tool, and method and apparatus for mounting component using this tool (2009-06-23),

5. 7516878 - Bump formation method and bump forming apparatus for semiconductor wafer (2009-04-14),

6. 7387229 - Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore (2008-06-17),

7. 7353596 - Component mounting method (2008-04-08),

8. 7350684 - Apparatus and method for forming bump (2008-04-01),

9. 7229854 - Electronic component mounting method and apparatus and ultrasonic bonding head (2007-06-12),

10. 7220922 - Electronic component, component mounting equipment, and component mounting method (2007-05-22),

11. 7219419 - Component mounting apparatus including a polishing device (2007-05-22),

12. 7052984 - Bump formation method and bump forming apparatus for semiconductor wafer (2006-05-30),

13. 7031509 - Method and apparatus for correcting inclination of IC on semiconductor wafer (2006-04-18),

14. 7021357 - Component mounting apparatus and component mounting method (2006-04-04),

15. 7020953 - Apparatus and method for mounting component (2006-04-04),

Title: Shinji Kanayama: Pioneering Inventor from Kashihara

Introduction: Shinji Kanayama is a renowned inventor hailing from Kashihara, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kanayama holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kanayama has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Kanayama has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Shinji Kanayama's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a trailblazer in the world of inventions and patents.

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