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For the Inventor, By the Inventor

Kashihara, Japan

Shinji Kanayama

This inventor holds 47 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Component Mounting. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 1995-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Kanayama. Retrieved from https://idiyas.com/inventor/shinji-kanayama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 40.4

 

Average Co-Inventor Count = 5.7

ph-index = 10

Forward Citations = 629(Granted Patents)


Location History:

  • Kajiwara, JP (2000)
  • Nara-ken, JP (2001)
  • Nara-ken., JP (2002)
  • Nara, JP (2002 - 2004)
  • Kashihara, JP (1995 - 2011)

Company Filing History:

goldMedal42 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
silverMedal5 out of 16,454 
 
Panasonic Corporation
 patents

Years Active: 1995-2011

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Areas of Expertise:
Component Mounting
Bump Formation
Ultrasonic Bonding
Semiconductor Wafer
IC Mounting
Frictional Connection
Charge Appearance
Packaging IC Chip
Bump Bonding
Post-Heating Operation
Component Feeder
Suction Holding
47 patents (USPTO):Explore Patents
1. 7861908 - Component mounting method, component mounting apparatus, and ultrasonic bonding head (2011-01-04),
2. 7827677 - Component mounting apparatus (2010-11-09),
3. 7797820 - Component mounting apparatus (2010-09-21),
4. 7549567 - Component mounting tool, and method and apparatus for mounting component using this tool (2009-06-23),
5. 7516878 - Bump formation method and bump forming apparatus for semiconductor wafer (2009-04-14),
6. 7387229 - Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore (2008-06-17),
7. 7353596 - Component mounting method (2008-04-08),
8. 7350684 - Apparatus and method for forming bump (2008-04-01),
9. 7229854 - Electronic component mounting method and apparatus and ultrasonic bonding head (2007-06-12),
10. 7220922 - Electronic component, component mounting equipment, and component mounting method (2007-05-22),
11. 7219419 - Component mounting apparatus including a polishing device (2007-05-22),
12. 7052984 - Bump formation method and bump forming apparatus for semiconductor wafer (2006-05-30),
13. 7031509 - Method and apparatus for correcting inclination of IC on semiconductor wafer (2006-04-18),
14. 7021357 - Component mounting apparatus and component mounting method (2006-04-04),
15. 7020953 - Apparatus and method for mounting component (2006-04-04),

Title: Shinji Kanayama: Pioneering Inventor from Kashihara

Introduction: Shinji Kanayama is a renowned inventor hailing from Kashihara, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kanayama holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his continuous dedication to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kanayama has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Kanayama has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Shinji Kanayama's relentless pursuit of innovation and his passion for creating technology that makes a difference have solidified his position as a trailblazer in the world of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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