The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2010
Filed:
Mar. 06, 2008
Satoshi Shida, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Shunji Onobori, Kyoto, JP;
Shuichi Hirata, Osaka, JP;
Mamoru Nakao, Moriguchi, JP;
Kunio Oe, Hirakata, JP;
Akira Kugihara, Katano, JP;
Shoriki Narita, Hirakata, JP;
Yoshitaka Etoh, Katano, JP;
Hiroshi Haji, Chikushino, JP;
Satoshi Shida, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Shunji Onobori, Kyoto, JP;
Shuichi Hirata, Osaka, JP;
Mamoru Nakao, Moriguchi, JP;
Kunio Oe, Hirakata, JP;
Akira Kugihara, Katano, JP;
Shoriki Narita, Hirakata, JP;
Yoshitaka Etoh, Katano, JP;
Hiroshi Haji, Chikushino, JP;
Panasonic Corporation, Osaka, JP;
Abstract
In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.