Katano, Japan

Akira Kugihara

This inventor holds 3 USPTO granted patents. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 2007-2010.


Average Co-Inventor Count = 7.5

ph-index = 2

Forward Citations = 331(Granted Patents)


Company Filing History:


Years Active: 2007-2010

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3 patents (USPTO):Explore Patents

Title: Akira Kugihara: Innovator in Component Mounting Technology

Introduction

Akira Kugihara is a notable inventor based in Katano, Japan. He has made significant contributions to the field of component mounting technology, holding a total of 3 patents. His innovative approaches have enhanced the efficiency and effectiveness of mounting processes in electronic manufacturing.

Latest Patents

Kugihara's latest patents include a "Component Mounting Apparatus" and a "Component Mounting Method." In these inventions, he describes a process for mounting multiple components onto a board. The method involves bringing bump electrode portions on the components into contact with a bonding-assistant agent. This allows for the efficient supply of the bonding-assistant agent to the components, facilitating their mounting onto the board. Notably, the process allows for the simultaneous supply of the bonding-assistant agent to multiple components, optimizing the overall mounting process.

Career Highlights

Throughout his career, Akira Kugihara has worked with prominent companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has contributed to his expertise in the field of electronic component mounting.

Collaborations

Kugihara has collaborated with several talented individuals, including Satoshi Shida and Shunji Onobori. These collaborations have further enriched his work and innovations in component mounting technology.

Conclusion

Akira Kugihara's contributions to component mounting technology demonstrate his innovative spirit and dedication to improving manufacturing processes. His patents reflect a commitment to advancing the field and enhancing efficiency in electronic assembly.

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