The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Mar. 27, 2003
Shozo Minamitani, Ibaraki, JP;
Takaharu Mae, Hirakata, JP;
Yasuharu Ueno, Osaka, JP;
Akira Yamada, Daito, JP;
Shinji Kanayama, Kashihara, JP;
Makoto Akita, Takatsuki, JP;
Nobuhisa Watanabe, Suita, JP;
Akira Mori, Toyonaka, JP;
Hiroyuki Naito, Toyonaka, JP;
Shinya Marumo, Higashiosaka, JP;
Makoto Morikawa, Ikoma, JP;
Shozo Minamitani, Ibaraki, JP;
Takaharu Mae, Hirakata, JP;
Yasuharu Ueno, Osaka, JP;
Akira Yamada, Daito, JP;
Shinji Kanayama, Kashihara, JP;
Makoto Akita, Takatsuki, JP;
Nobuhisa Watanabe, Suita, JP;
Akira Mori, Toyonaka, JP;
Hiroyuki Naito, Toyonaka, JP;
Shinya Marumo, Higashiosaka, JP;
Makoto Morikawa, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.