Takaharu Mae

Title: **Takaharu Mae: A Pioneer in Component Mounting Technologies**

Introduction

Takaharu Mae, based in Hirakata, Japan, is an accomplished inventor known for his significant contributions to the field of component mounting and semiconductor technologies. With a total of 21 patents to his name, Mae has established himself as a leading figure in innovations that enhance productivity and reliability in component assembly processes.

Latest Patents

Among his most recent patents, Mae has developed several groundbreaking inventions. His first notable patent is the "Component mounting method, component mounting apparatus, and ultrasonic bonding head." This invention details a sophisticated component mounting apparatus featuring a component feeder, a mounting head, a supporting base, and a positioning device. The innovative design allows for ultrasonic bonding with high reliability, even when dealing with components that have numerous bump electrodes.

Another remarkable invention is the "Bump formation method and bump forming apparatus for semiconductor wafer." This patent addresses the challenges of productivity in bump formation on semiconductor wafers. By using a combination of a bump forming head, a recognition device, and a control device, the invention allows for continuous bump formation on integrated circuits within a basic block, significantly reducing the need for frequent positional recognition and improving overall productivity.

Career Highlights

Throughout his career, Mae has been associated with prominent companies that have shaped the electronics industry. He has worked for Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation, contributing his expertise to advance the companies' technological capabilities.

Collaborations

Mae's journey in innovation has not been undertaken alone; he has collaborated with esteemed coworkers, including Shinji Kanayama and Shoriki Narita. Their joint efforts have fueled the development of cutting-edge technologies that continue to make a profound impact on the sector.

Conclusion

Takaharu Mae stands out as a key innovator whose patents have driven advancements in component mounting and semiconductor technologies. His inventions not only enhance productivity but also ensure reliability in manufacturing processes. With a commitment to innovation and collaboration, Mae's work continues to influence the future of the electronics industry, making him a noteworthy figure in the landscape of modern invention.