The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Dec. 20, 2002
Shunji Onobori, Kyoto-fu, JP;
Shuichi Hirata, Osaka, JP;
Masakazu Yamano, Matsubara, JP;
Kazuya Yamamoto, Neyagawa, JP;
Satoshi Shida, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Makoto Akita, Takatsuki, JP;
Shozo Minamitani, Ibaraki, JP;
Shunji Onobori, Kyoto-fu, JP;
Shuichi Hirata, Osaka, JP;
Masakazu Yamano, Matsubara, JP;
Kazuya Yamamoto, Neyagawa, JP;
Satoshi Shida, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Makoto Akita, Takatsuki, JP;
Shozo Minamitani, Ibaraki, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
After detection of contact between respective solder bumps of an electronic component, sucked and held by a suction nozzle of a head tool, and respective solder portions of a circuit board, the solder bumps and the solder portions are melted by heating. Releasing of the electronic component from suction and holding by the suction nozzle of the head tool is performed, not at a time during solder melting, but at a time after the solder is melted, cooled and solidified. Thus, an electronic component mounting method and apparatus capable of mounting high-end electronic components having narrow-pitched bumps are provided.