The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2006
Filed:
Nov. 20, 2001
Shoriki Narita, Hirakata, JP;
Masahiko Ikeya, Sakai, JP;
Yasutaka Tsuboi, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Shoriki Narita, Hirakata, JP;
Masahiko Ikeya, Sakai, JP;
Yasutaka Tsuboi, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Matsushita Electric Industrial Co., Ltd., Osaka-Fu, JP;
Abstract
There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.