This inventor holds 15 USPTO granted patents and 1 published patent application. Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Intellectual Property Management Co., Ltd., Panasonic Corporation. Active years: 1998-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Yamanashi-ken, JP (1999)
- Osaka, JP (2003)
- Hirakata, JP (2004 - 2009)
- Yamanashi, JP (1998 - 2018)
Company Filing History:
9 out of 27,375 
5 out of 13,338 
1 out of 16,454 
Years Active: 1998-2018
Title: Yasutaka Tsuboi: Innovator in Bonding and Crimping Technologies
Introduction
Yasutaka Tsuboi is a prominent inventor based in Hirakata, Japan. He has made significant contributions to the field of bonding and crimping technologies, holding a total of 15 patents. His innovative approaches have advanced the efficiency and effectiveness of electronic component assembly.
Latest Patents
Tsuboi's latest patents include a bonding apparatus designed to enhance the bonding process of electronic components to light-transmissive boards. This apparatus features a backup unit with a light-transmissive transmission member that supports the bonding region from below. It also includes a pressure-bonding unit that presses the electronic component onto the adhesive agent, along with a light irradiation unit that promotes the hardening of the adhesive. Additionally, the bonding apparatus is equipped with a light distribution measuring unit to assess the light distribution from the irradiation portion.
Another notable invention is a component crimping apparatus that holds a substrate of transparent material. This apparatus utilizes crimping tools that press components onto the substrate while irradiating the adhesive member with light through a transparent member. The design allows for precise movement and coverage of the crimping tools, ensuring effective bonding.
Career Highlights
Throughout his career, Tsuboi has worked with esteemed companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Intellectual Property Management Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative technologies.
Collaborations
Tsuboi has collaborated with notable coworkers, including Masahiko Ikeya and Shinji Kanayama. Their combined efforts have led to advancements in the field of electronic component assembly.
Conclusion
Yasutaka Tsuboi's contributions to bonding and crimping technologies have made a significant impact in the industry. His innovative patents and collaborations reflect his dedication to advancing electronic assembly processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile