The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 2018

Filed:

Sep. 26, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Yasutaka Tsuboi, Yamanashi, JP;

Akira Yamada, Yamanashi, JP;

Toshihiko Tsujikawa, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); H05K 13/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0469 (2013.01); H05K 13/08 (2013.01);
Abstract

A bonding apparatus includes: a backup unit including a light-transmissive transmission member having a support surface which supports at least a bonding region of a light-transmissive board from below; a pressure-bonding unit which presses an electronic component placed on the bonding region via a photo-curable adhesive agent; and a light irradiation unit which irradiates the supporting surface with light which promotes hardening of the adhesive agent. The electronic component is bonded to the board by pressing the electronic component mounted on a top surface of the adhesive agent in a state in which light from the light irradiation unit is incident upon the adhesive agent through the supporting surface. The bonding apparatus further includes a light distribution measuring unit which measures a distribution of light from the light irradiation portion in the supporting surface.


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