The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Nov. 16, 2001
Shoriki Narita, Hirakata, JP;
Masahiko Ikeya, Sakai, JP;
Yasutaka Tsuboi, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Shoriki Narita, Hirakata, JP;
Masahiko Ikeya, Sakai, JP;
Yasutaka Tsuboi, Hirakata, JP;
Takaharu Mae, Hirakata, JP;
Shinji Kanayama, Kashihara, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.