Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Shinji Kanayama

Takaharu Mae

Shoriki Narita

Kenji Takahashi

Shozo Minamitani

Makoto Imanishi

Kazushi Higashi

Satoshi Shida

Masahiko Ikeya

Nobuhisa Watanabe

Yasutaka Tsuboi

Kenichi Nishino

Takashi Shimizu

Yasuharu Ueno

Hiroshi Wada

Akira Kabeshita

Shunji Onobori

Hiroyuki Otani

Takahiro Yonezawa

Shuichi Hirata

Koichi Yoshida

Nobuya Matsumura

Hiroyuki Kiyomura

Makoto Akita

Takafumi Tsujisawa

Hiroshi Haji

Akira Yamada

Makoto Morikawa

Hiroyuki Yoshida

Ryoji Inutsuka

Shinjiro Tsuji

Naoto Hosotani

Hiroyuki Naito

Osamu Nakao

Nobuhiko Muraoka

Kenji Fukumoto

Kohei Enchi

Shinzo Eguchi

Shinya Marumo

Mamoru Nakao

Kunio Oe

Akira Kugihara

Ryoichiro Katano

Yoshitaka Etoh

Akira Mori

Satoshi Ohnakada

Takahiko Murata

Akihiro Yamamoto

Kazuto Nishida

Yoshifumi Kitayama

Koichi Kumagai

Kenji Okamoto

Yoshinori Wada

Hiroshi Nasu

Tomotaka Nishimoto

Hiroaki Hayashi

Masaru Ichihara

Masayuki Ida

Yuichi Takakura

Yasuhiro Noma

Yasuhiro Kametani

Akimitsu Mukai

Naomi Kainou

Kazuhiro Kimura

Satoshi Sida

A component mounting apparatus includes a component feeder that feeds a component with its bump electrodes facing down, a mounting head that mounts the component onto a substrate, a supporting base that secures the substrate, and a positioning device that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator, an ultrasonic vibration propagation member that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face holding the component as vibration parallel thereto, a pressure loader that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes on its face.

Component mounting method, component mounting apparatus, and ultrasonic bonding head

A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

Component mounting apparatus

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Componentis pressed onto a circuit boardso that their respective metal interconnectsare in close contact with each other, and ultrasonic vibration is applied to the suction nozzleholding the component. Friction is thereby generated between metal interconnectswhereby the componentis bonded on circuit substrate. Suction nozzlefor handling components is made of stainless steel and has a working faceprovided with a hardened layer, or alternatively, suction nozzlemay have a suction headhaving a working facemade of cemented carbide. Working faceof suction nozzleis refined by polishing as required during the mounting operation.

Component mounting tool, and method and apparatus for mounting component using this tool

A bump formation method and a bump forming apparatus for a semiconductor wafer are provided in which productivity when bumps are formed onto the semiconductor wafer is improved as compared with the conventional art. There are provided a bump forming head, a recognition device, and a control device. ICs formed on the semiconductor wafer are divided into basic blocks. Bump formation is performed continuously for the ICs included in one basic block. Positional recognition for the other basic blocks is performed only when the bump formation operation is shifted from one basic block to another basic block. Thus, in comparison with the conventional art whereby a positional recognition operation is performed every time bumps are formed on each IC, the number of times of performing positional recognition is greatly reduced, so that productivity can be improved.

Bump formation method and bump forming apparatus for semiconductor wafer

A bump forming apparatus which carries out a temperature control of a type different from the conventional art in forming bumps to a semiconductor wafer, and a bump formation method executed by the bump forming apparatus are provided. A bonding stage, a load and transfer device and a control device are provided. A wafer, after having bumps formed thereon, is held by the load and transfer device and arranged above the bonding stage through control by the control device, so that a temperature drop of the wafer is controlled. Accordingly, generation of troubles such as a crack because of thermal stress and the like can be prevented to even compound semiconductor wafers sensitive to a temperature change.

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board. The component mounting process includes supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting method

A preheat device () is provided to execute, before forming bumps () to electrode parts (), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage () through controlling the heating by a controller ().

Apparatus and method for forming bump

A component mounting apparatus includes a component feeder () that feeds a component () with its bump electrodes facing down, a mounting head () that mounts the component onto a substrate (), a supporting base () that secures the substrate, and a positioning device () that aligns the component with the substrate. The mounting head includes an ultrasonic vibration generator (), an ultrasonic vibration propagation member () that conveys the ultrasonic vibration provided by the ultrasonic vibration generator to a working face () holding the component as vibration parallel thereto, a pressure loader () that applies a pressure load to the working face from a position immediately thereabove in the direction perpendicular thereto, and a heater () that heats the vicinity of the working face. Thereby, ultrasonic bonding is carried out with high reliability even if the component has a number of bump electrodes () on its face.

Electronic component mounting method and apparatus and ultrasonic bonding head

Component () is pressed onto a circuit board () so that their respective metal interconnects (), () are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle () holding the component (). Friction is thereby generated between metal interconnects (), () whereby the component () is bonded on circuit substrate. Suction nozzle () for handling components is made of stainless steel and has a working face (a) provided with a hardened layer (b), or alternatively, suction nozzle () may have a suction head (c) having a working face (a) made of cemented carbide. Working face (a) of suction nozzle () is refined by polishing as required during the mounting operation.

Component mounting apparatus including a polishing device

Component mounting equipment mounts an FPC board onto an LCD board. The LCD board has a first electrode section on one side edge and a second electrode section on another side edge. The FPC board has a first section on one side edge and a second section on another side edge. A first mounting apparatus mounts the first section on the first electrode section. A second mounting apparatus mounts the second section on the second electrode section. In the second component mounting apparatus, the second section is separated from the second electrode section at an ACF supply section and released at a pre-press bonding section.

Electronic component, component mounting equipment, and component mounting method

There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.

Method and apparatus for correcting inclination of IC on semiconductor wafer

Apparatus and method for mounting component

A component-mounting apparatus is provided with a pallet-carrying unit that carries a pallet, holding boards, within the apparatus. The pallet-carrying unit carries the pallet to a loading unit for feeding boards to the pallet, an ACF applying unit for applying an ACF tape onto the boards, a pre-press bonding unit for positioning components relative to the boards and bonding the components with a first pressing force, a final bonding unit for bonding the components to the boards with a second pressing force larger than the first pressing force so as to fix the components onto the boards, and an unloading unit for removing the boards, with the components mounted thereon, from the pallet. Then, the pallet-carrying unit returns the pallet from the unloading unit to the loading unit.

Component mounting apparatus and component mounting method

Growing community of inventors

Kashihara, Japan

Shinji Kanayama