Matsushita Electric Industrial Co., Ltd.

Koichi Yoshida

Makoto Imanishi

Akihiro Yamamoto

Kazushi Higashi

Takahiro Yonezawa

Shinji Kanayama

Hiroshi Wada

Kenichiro Suetsugu

Shoriki Narita

Hiroyuki Otani

Takaharu Mae

Tetsuo Fukushima

Masahiko Ikeya

Kenji Fukumoto

Shinzo Eguchi

Kouji Hirotani

Yasuo Kudoh

Toshikuni Kojima

Masao Fukuyama

Osamu Nakao

A preheat device () is provided to execute, before forming bumps () to electrode parts (), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage () through controlling the heating by a controller ().

Apparatus and method for forming bump

Device and method for forming bump

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate having a side for positioning the electronic part, a plate having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring for applying a regulating force to the regulating plate in order to press the electronic part to the plate

Bump bonding device and bump bonding method

To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage,for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate,having a side for positioning the electronic part, a plate,having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring,for applying a regulating force to the regulating plate in order to press the electronic part to the plate

Process for manufacturing a resin-encapsulated electronic product

The present invention provides a bump bonding method that can prevent bumps from being inappropriately shaped. The bump bonding method comprises forming a gold ball (16) at the tip of a gold wire (1) that is inserted through a capillary (3), lowering the capillary (3) while using a displacement detection sensor to detect the vertical displacement of the capillary (3), detecting the position of that portion of an IC (11) in which an electrode is formed, based on the displacement of the capillary (3) detected by the displacement detection sensor when the gold ball (16) abuts the IC (11), pressing he gold ball (16) against the electrode forming portion to form a bump pedestal (17), elevating the capillary (3) a specified amount while moving it in the horizontal direction a specified amount, setting the height S of a position at which the capillary (3) is stopped based on the height H1 of the bump pedestal (17) detected by the displacement detection sensor, again lowering the capillary (3) down to the stop position height S to join the gold wire (1) to the bump pedestal (17), and then lifting the gold wire (1) to break the joint between the bump pedestal (17) and the gold wire (1).

Bump bonding method and bump bonding apparatus

The object is to provide a bump bonder wherein the drop of the tact efficiency of bump formation can be reduced to a low level by discard-bonding of unsatisfactory balls (3) so that satisfactory bumps can be formed. It features arranging a discard bonding chip (19) on bonding stage (17), which holds in their prescribed positions the semiconductor chips (13a), (13b) that are to be subjected to bump formation and performing discard bonding to discard bonding chip (19). Due to this construction, discard bonding can be effected without needing to move the capillary far from the bonding stage (17), which is the working position.

Bump bonder with a discard bonding area

An electronic circuit substrate is sealed with a sealing material made of thermoplastic resin having a thermal-expansion coefficient close to that of a ceramic substrate by a compound filler dispersedly mixed in the sealing material. The filler includes at least two of milled fiber, glass fiber, and flaked filler.

Electronic circuit substrate

Solid electrolytic capacitors comprise a valve metal member having a dielectric film, with or without a conductive underlying layer, formed on the member, and a conductive polymer film formed on the layer. The conductive polymer film is formed by electrolytic polymerization of a polymerizable monomer contained in a system which comprises the monomer, a support electrolyte, and at least one member selected from silicic acids and silicates with or without phenol compounds. By this, the life of the capacitor even under high temperature and high humidity conditions is significantly improved. Methods for fabricating such capacitors are also described.

Solid electrolytic capacitors and method for manufacturing the same

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Higashiosaka, Japan

Koichi Yoshida