The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 2004
Filed:
Mar. 11, 2002
Applicant:
Inventors:
Tetsuya Tokunaga, Kadoma, JP;
Takahiro Yonezawa, Neyagawa, JP;
Hiroyuki Kiyomura, Takatsuki, JP;
Tatsuo Sasaoka, Osaka, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23B 3/100 ; H01L 2/1306 ; H01L 2/144 ; H01L 2/178 ;
U.S. Cl.
CPC ...
B23B 3/100 ; H01L 2/1306 ; H01L 2/144 ; H01L 2/178 ;
Abstract
A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.
Tokunaga, Tetsuya. (2004). Bonding method and apparatus (U.S. Patent No. 6712111). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6712111
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile