Hiroyuki Kiyomura

Title: Hiroyuki Kiyomura: Innovator in Semiconductor Bonding Technologies

Introduction

Hiroyuki Kiyomura is a prominent inventor based in Takatsuki, Japan. He has made significant contributions to the field of semiconductor bonding technologies, holding a total of 7 patents. His work focuses on improving the efficiency and accuracy of bonding methods used in integrated circuits.

Latest Patents

Kiyomura's latest patents include a bump bonding method apparatus. This innovative technique involves forming a bump on an integrated circuit (IC) by creating a ball at the tip of a gold wire protruding from a capillary. The process utilizes ultrasonic vibration applied through the capillary while pressing the ball against a pad portion on the IC. The ultrasonic vibration is applied at a frequency range of 130 to 320 kHz, with a preference for 170 to 270 kHz, and most ideally at 230±10 kHz at room temperature and atmospheric pressure. This method allows for the formation of bumps on ICs with low heat resistance temperatures, ensuring satisfactory joint conditions and good positional accuracy without affecting the surrounding areas. Another notable patent is a bonding method and apparatus that employs a carrier tool with a protective ring. This design helps to prevent damage to semiconductor wafers during the bonding process.

Career Highlights

Hiroyuki Kiyomura is associated with Matsushita Electric Industrial Co., Ltd., where he has been instrumental in advancing semiconductor technologies. His innovative approaches have led to improved bonding techniques that enhance the reliability and performance of electronic devices.

Collaborations

Kiyomura has collaborated with notable colleagues, including Takahiro Yonezawa and Tetsuya Tokunaga. Their combined expertise has contributed to the development of cutting-edge bonding technologies in the semiconductor industry.

Conclusion

Hiroyuki Kiyomura's contributions to semiconductor bonding technologies have established him as a key figure in the field. His innovative patents and collaborative efforts continue to influence advancements in electronic manufacturing.