The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2005
Filed:
Nov. 15, 2002
Satoshi Horie, Kadoma, JP;
Takahiro Yonezawa, Neyagawa, JP;
Hiroyuki Kiyomura, Takatsuki, JP;
Tetsuya Tokunaga, Takatsuki, JP;
Tatsuo Sasaoka, Osaka, JP;
Satoshi Horie, Kadoma, JP;
Takahiro Yonezawa, Neyagawa, JP;
Hiroyuki Kiyomura, Takatsuki, JP;
Tetsuya Tokunaga, Takatsuki, JP;
Tatsuo Sasaoka, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
In a bump bonding technique for forming a bump on an IC, including forming a ball at the tip of a gold wire protruding from a capillary, and providing a metal-to-metal joint by applying ultrasonic vibration from a ultrasonic head through the capillary while pressing the ball against a pad portion on the IC, the metal-to-metal joint is provided by applying the ultrasonic vibration at a frequency in a range of 130 to 320 kHz, more preferably in a range of 170 to 270 kHz, and most preferably at a frequency of 230±10 kHz at room temperatures and atmospheric pressure. Consequently, a bump is formed on an IC having a low heat resistance temperature in a satisfactory joint condition, and a bump is formed with good positional accuracy without giving the influence of heat to the surroundings.