The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2006
Filed:
Mar. 08, 2005
Kazushi Higashi, Neyagawa, JP;
Norihito Tsukahara, Souraku-gun, JP;
Takahiro Yonezawa, Neyagawa, JP;
Yoshihiko Yagi, Ashiya, JP;
Yoshifumi Kitayama, Hirakata, JP;
Hiroyuki Otani, Ikoma, JP;
Kazushi Higashi, Neyagawa, JP;
Norihito Tsukahara, Souraku-gun, JP;
Takahiro Yonezawa, Neyagawa, JP;
Yoshihiko Yagi, Ashiya, JP;
Yoshifumi Kitayama, Hirakata, JP;
Hiroyuki Otani, Ikoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.