IDiyas

For the Inventor, By the Inventor

Hirakata, Japan

Yoshifumi Kitayama

USPTO Granted Patents = 13

Average Co-Inventor Count = 3.9

ph-index = 6

Forward Citations = 115(Granted Patents)


Company Filing History:

goldMedal13 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents

Years Active: 1987-2006

Loading Chart...
13 patents (USPTO):Explore Patents
1. 7071090 - Semiconductor element having protruded bump electrodes (2006-07-04),
2. 6894387 - Semiconductor element having protruded bump electrodes (2005-05-17),
3. 6455099 - Method and device for applying sealant to IC having bumps (2002-09-24),
4. 6370750 - Component affixing method and apparatus (2002-04-16),
5. 6332268 - Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor (2001-12-25),
6. 6207549 - Method of forming a ball bond using a bonding capillary (2001-03-27),
7. 5791484 - Assembly of chip parts (1998-08-11),
8. 5744382 - Method of packaging electronic chip component and method of bonding of (1998-04-28),
9. 5646439 - Electronic chip component with passivation film and organic protective (1997-07-08),
10. 5240170 - Method for bonding lead of IC component with electrode (1993-08-31),
11. 5116228 - Method for bump formation and its equipment (1992-05-26),
12. 5012388 - Electrode structure of a chip type electronic component (1991-04-30),
13. 4676864 - Bonding method of semiconductor device (1987-06-30),

Title: Innovations of Yoshifumi Kitayama

Introduction

Yoshifumi Kitayama is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His work has been instrumental in advancing the efficiency and functionality of integrated circuits.

Latest Patents

One of his latest patents involves a semiconductor element featuring protruded bump electrodes. This innovative method of forming a bump electrode on an integrated circuit (IC) electrode includes several steps. First, a ball bond is formed on an IC electrode using a wire bonding apparatus. Next, the bonding capillary is moved upward, then sideways, and finally downward. An Au wire is bonded to the ball bond portion, and the Au wire is cut. Importantly, the Au wire is prevented from contacting areas around the ball bond portion, as the descent position of the bonding capillary is preset to a height above where the ball bond is formed.

Career Highlights

Yoshifumi Kitayama has been associated with Matsushita Electric Industrial Co., Ltd., where he has contributed to various projects and innovations. His expertise in semiconductor technology has positioned him as a key figure in the industry.

Collaborations

He has worked alongside talented colleagues such as Kazushi Higashi and Takahiro Yonezawa, contributing to a collaborative environment that fosters innovation and creativity.

Conclusion

Yoshifumi Kitayama's contributions to semiconductor technology through his patents and collaborations highlight his importance in the field. His innovative methods continue to influence the development of integrated circuits, showcasing the impact of his work on modern technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…