The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1992
Filed:
Oct. 23, 1989
Applicant:
Inventors:
Akira Kabeshita, Hirakata, JP;
Yoshifumi Kitayama, Hirakata, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; B23K / ;
U.S. Cl.
CPC ...
29842 ; 228-31 ; 2281802 ; 29840 ; 174261 ;
Abstract
A method and apparatus is provided for forming bumps on a plurality of IC chips arranged in a checkered pattern on a wafer. The bumps are formed from bump bases fixed to each IC chip. A forming tool having a recessed part of a height that is greater than the height of the bump bases is used to deform the bump bases into bumps. The forming tool is pressed by an elevating driving device against the bump bases under pressure sufficient to deform a respective part of each of the bump bases secured to each IC chip into a shape corresponding to that of the recess defined by the forming tool.