Hirakata, Japan

Akira Kabeshita

This inventor holds 71 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in Component Mounting (CPC class H05K). Top assignees: Matsushita Electric Industrial Co., Ltd., Panasonic Corporation. Active years: 1983-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akira Kabeshita. Retrieved from https://idiyas.com/inventor/akira-kabeshita

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 71 

% Patents Active = 67.6


Average Co-Inventor Count = 3.8

ph-index = 15

Forward Citations = 715(Granted Patents)

Forward Citations (Not Self Cited) = 690(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Moriguchi, JP (1983 - 1984)
  • Miriguchi, JP (1984)
  • Katano, JP (1992)
  • Osaka-fu, JP (2002)
  • Hirataka, JP (2003)
  • Saga, JP (2010)
  • Osaka, JP (1987 - 2011)
  • Hirakata, JP (1989 - 2011)
  • Yamanashi, JP (2011 - 2013)

Company Filing History:


Years Active: 1983-2013

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Areas of Expertise:
Component Mounting
Apparatus Design
Chip Removal
Solder Paste Printing
Feeding Device
Part Mounting
Component Holder
Electronic Components
Conveying Method
Vertical Chip Reversal
Paste Transfer
Calibration Jig
71 patents (USPTO):Explore Patents

Title: The Innovative Mind of Akira Kabeshita

Introduction

Akira Kabeshita, hailing from Hirakata, Japan, is a prolific inventor with an impressive portfolio of 71 patents. His work primarily focuses on advancements in component mounting and press bonding technologies, showcasing his innovative approach to solving complex industrial challenges.

Latest Patents

Among his latest patents, the "Component Mounting Apparatus and Method" stands out. This invention entails a sophisticated mechanism for mounting components on various regions of a substrate's edge. It comprises component placing units, component feeding units, and carrying units, all working together to ensure high efficiency even with large substrates. Another notable invention is the "Component Press Bonding Apparatus and Method," which utilizes intricate link mechanisms for precise movements of press bonding heads, enhancing the effectiveness of bonding processes in manufacturing.

Career Highlights

Akira Kabeshita has made significant contributions while working at notable companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these leading organizations has allowed him to refine his skills and enhance his innovative capabilities in the field of electronics and component manufacturing.

Collaborations

Throughout his career, Kabeshita has collaborated with esteemed colleagues, including Osamu Okuda and Naoyuki Kitamura. These partnerships have led to the development of groundbreaking technologies, underscoring the importance of teamwork in driving innovation forward.

Conclusion

In summary, Akira Kabeshita's contributions to the field of component mounting and press bonding have set a benchmark for efficiency and innovation. His extensive patent portfolio and collaborations with industry leaders reflect a relentless pursuit of excellence and advancement in technology. As a prominent figure in the world of inventions, Kabeshita continues to inspire future innovators in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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