Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Akira Kabeshita

Osamu Okuda

Noriaki Yoshida

Naoyuki Kitamura

Naoto Mimura

Satoshi Shida

Yoshihiro Yoshida

Takeshi Takeda

Kazuhiro Mori

Yoshihiko Misawa

Tadashi Endo

Takao Kashiwazaki

Yoichi Makino

Shinji Kanayama

Takeyuki Kawase

Hiroshi Uchiyama

Masato Tanino

Koji Okawa

Kazuo Mori

Shuichi Kubota

Kazunori Kanai

Shozo Minamitani

Tokuhito Hamane

Makoto Imanishi

Eiji Itemadani

Kurayasu Hamasaki

Nobuyuki Kakita

Noriyuki Tani

Makoto Sueki

Kohei Enchi

Kenji Takahashi

Hideaki Watanabe

Takaaki Higashida

Yoshihiro Mimura

Takao Naito

Hiroaki Onishi

Mamoru Inoue

Kenichi Nishino

Yoshifumi Kitayama

Souhei Tanaka

Hirofumi Obara

Nobuhiko Muraoka

Taira Ishii

Shoji Sato

Tetsutarou Hachimura

Tateo Ando

Satoshi Ohnakada

Sohei Tanaka

Toshiro Nishiwaki

Mitsuo Kawate

Yuji Miyata

Takahiko Murata

Kazuto Nishida

Yukio Maeda

Satoshi Kawaguchi

Ken Takano

Nobuhisa Watanabe

Kenji Okamoto

Atsushi Tanabe

Keiji Saeki

Syozo Kadota

Osamu Nakao

Hideo Sakon

Akira Iizuka

Hiroshi Nakagawa

Hachiro Nakatsuji

Yuzuru Inaba

Koji Odera

Koichi Morita

Masahiro Morimoto

Noboru Furuta

Kazuaki Kosaka

Masaya Watanabe

Izumi Miura

Kazuhiro Kimura

Hisako Matsui

Shigeru Araki, Deceased

Syuichi Murakami

Shinichi Kudoh

Shinichi Kudou

Sakae Kobayashi

A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

Component mounting apparatus and method

Link mechanisms provided corresponding to press bonding heads each include a first link member having one end pivotably connected to an upper end of the press bonding head, a second link member having one end pivotably connected to the other end of the first link member and having the other end pivotably connected to a link bracket above the press bonding head, and a connection slide part connected to a connection part between the first and second link members, collectively drive the connection slide parts of the link mechanisms by a press bonding head driving unit in horizontal directions (Y axis directions) orthogonal to a direction (X axis direction) of side-by-side arrangement of the plurality of press bonding heads, open and close the first and second link members of the link mechanisms in the vertical directions thereby collectively moving the plurality of press bonding heads downward and upward.

Component press bonding apparatus and method

A substrate cleaning apparatus for cleaning a front-side clean target surfacea and a back-side clean target surfaceb of a edge portion of a substrateby wiping surfacesa,b of a cleaning tape. The substrate cleaning apparatus includes a presser membera for pressing the cleaning tapeagainst the clean target surfacea, a presser memberb for pressing the cleaning tapeagainst the clean target surfaceb, a tape path passing through between the presser membera and the clean target surfacea and between the presser memberb and the clean target surfaceb, a moving device for moving the cleaning tapeand the substraterelative to each other in a longitudinal direction of the edge portion.

Substrate cleaning apparatus and method employed therein

A component mounting apparatus for mounting a plurality of components on a board. The apparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting apparatus

It is an object of the invention to provide a liquid substance supplying device exhibiting high operability in handling a container having a large capacity. A liquid substance supplying device for supplying a liquid substance reserved in a vertically elongated containerhas a configuration in which a bottom part of a container holderfor holding the container inserted through an insertion hole provided on a top side of a holder main bodyis pivoted on a base bracketwith a hinge portionto support the container holdersuch that it can assume either upright attitude or tilted attitude and in which the container holderis fixed in the upright attitude by a holder fixing mechanism. As a result, the container holdercan be mounted and removed to and from the holder main bodyin the tilted state at the time of a container replacing operation, which allows high operability to be maintained even in handling a large-capacity container having a great height dimension.

Liquid substance supplying device

In a flux transfer unit to be used in an electronic component mounting apparatus for transferring flux to an electronic component picked up from a component feed unit and then mounting the electronic component onto a board, a blade holding head which has a first blade and a second blade for film formation use and scraping use of flux, respectively, and which is reciprocatively driven by a rodless cylinder via a drive transmission pin, is held by a movable member so as to be swingable about a swing support pin, and the movable member is braked with a specified braking force by a plate spring member. Thus, each time the direction of motion of the blade is reversed, the blade holding head swings, so that the first blade and the second blade can be automatically switched over without providing any exclusive drive mechanism.

Paste transfer device and electronic component mounting apparatus

In a chip reversing method for holding and vertically reversing a chip placed by a bonding nozzle, the chip is held on a chip holding unit disposed in a reversing member and is vertically reversed by turning the reversing member downward on an reversal shaft. After the reversed chip was received by a chip receiving unit, this chip receiving unit is lowered to a retracted position to return the reversing member to an original position. In this state, the chip receiving unit is raised to position the chip at a height level L for a chip transferring action. As a result, the reversing member does not protrude to above the height level for the chip transfer thereby to interfere with another mechanism, so that the chip mounting actions can be made efficient.

Method for reversing a chip vertically

While a vicinity of a bottom surface-side region of a pressure-sensitive adhesive sheet, corresponding to an adhesion region of a semiconductor chip, is sucked and held, a plurality of protruding portions of a removing member are brought into contact with the bottom surface of the semiconductor chip through the adhesive sheet at the adhesion region. Also, the adhesive sheet is sucked in between the respective protruding portions so as to change an adhesive surface bond of the semiconductor chip to the adhesive sheet to point bonding. Further, the removing member is moved along the bottom surface of the semiconductor chip so as to change the position of the point bonding and decrease the adhesive bonding force to the adhesive sheet. Then, the semiconductor chip is removed from the adhesive sheet.

Apparatus and method for removing semiconductor chip

A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

Component mounting method

When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

A magazine is provided with two opening portions that enable insertion and extraction of a tray and are approximately orthogonal to each other, and a regulation portion for regulating insertion and extraction of the tray from the opening portions. A tray component feeding device has a loading port for loading the magazine thereinto, and an extraction port for extracting a tray plate of the magazine, which are approximately orthogonal to each other. Further, a component mounting device is provided with the tray component feeding device loaded with the magazine on a lateral side of the component mounting device to which a transfer conveyor for transferring a circuit board extends.

Magazine, tray component feeding device, and component mounting device

In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working drive units, board conveying/holding devices, recognition cameras and so forth are also arranged in the work area. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

Device and method for conveying and holding plate-like member

A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.

In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working their drive units, board conveying/holding devices recognition cameras and so forth are also arranged. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

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Hirakata, Japan

Akira Kabeshita