Matsushita Electric Industrial Co., Ltd.

Yoshifumi Kitayama

Kazushi Higashi

Takahiro Yonezawa

Norihito Tsukahara

Yoshihiko Yagi

Hiroyuki Otani

Keiji Saeki

Akira Kabeshita

Kazuhiro Mori

Takashi Akiguchi

Akihiro Yamamoto

Shinji Kanayama

Osamu Yamazaki

Junji Ikeda

Tokuhito Hamane

Makoto Imanishi

Hiroyuki Yoshida

Kazuhiro Nobori

Kazuto Nishida

Yukio Maeda

Youichi Nakamura

Koichi Kumagai

Yoshinori Wada

Nobuya Matsumura

Shoji Sato

Yoichi Nakamura

Kouhei Enchi

Shuichi Murakami

A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

Semiconductor element having protruded bump electrodes

A method and a device for applying a sealant to an IC having bumps, which can solve a cobwebbing problem when a dispense nozzle is raised after the sealant has been applied and implement a productivity improvement; specifically, a method and a device for applying a sealant to an IC having bumps, wherein a dispense nozzle ( ) is raised in a first stage (E) at a low speed simultaneously with the stop of dispensing until the first stage (E) covers a specified height and then it is raised in a second stage (F) at a high seed. The above design, in which the dispense nozzle ( ) is raised in the first stage (E) at a low speed after the application of the sealant ( ) and the nozzle ( ) is then raised at a high speed and in a short time in the second stage (F), can positively break off the sealant ( ) without inducing cobwebbing and enhance productivity.

Method and device for applying sealant to IC having bumps

The component ( ) is first brought into point or line contact with the sheet ( ) so as to avoid entrapment of air therebetween. The contact area between the component and the sheet is then gradually spread until the entire bottom surface of the component is adhered to the sheet.

Component affixing method and apparatus

An IC chip (,) can be provided to a pre-mount process while being held on a tape-shaped supporting member (,), without being taken out of the tape-shaped supporting member (,).

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Method of forming a ball bond using a bonding capillary

By a manufacturing method including a process of supplying a connection-releasable connecting material (4) onto a surface of a plurality of chip parts (3) and a process of connecting the plurality of chip parts (3) by the connecting material (4), there is formed a chip assembly (1) comprised of the plurality of chip parts (3) connected with each other by means of the releasable connecting material (4). Further provided is a method of preparing the chip assembly (1), a process of releasing connection achieved by the connecting material (4) between a target chip part and an adjacent chip part, and a process of mounting the target chip part separated through releasing of the connection onto a board and soldering the same, thereby providing chip parts capable of easily coping with an increase of operation speed of chip parts on the process of mounting line, achieving an improved space efficiency, and suppressing waste of resources.

Assembly of chip parts

An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the water, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. Such component is packed in a package including a carrier tape having therethrough a space for receiving the component with one end of such space open. A cover is applied to close the open end of the space after the component is inserted therein.

Method of packaging electronic chip component and method of bonding of

An electronic chip component includes an electrode formed on a wafer, a passivation film formed on the wafer, and an organic protective film covering an entire surface of exposed portions of the electrode and the passivation film. A package for packing the component includes a carrier tape having therethrough a space for receiving the component with one end or side of the space opened, and a cover tape for closing the open end of the space after the component is stored in the space. A method for packing the component includes the steps of storing the component in the space of the carrier tape with one end of the space opened, and closing the open end of the space with the cover tape.

Electronic chip component with passivation film and organic protective

A method for bonding leads of an IC component with electrodes of a circuit board includes the steps of using a mounting device to hold the IC component with flat portions of the leads inclined downward, mounting the IC component on the circuit board at a predetermined position thereof with the IC component held by the mounting device, moving the mounting device toward the circuit board to compress the IC component against the circuit board at the predetermined position while allowing the leads to flex to accommodate for nonuniformity in the heights of metal pieces to be bonded with the electrodes and bending of the circuit board. In this manner, the flat portions of the leads are brought into close contact with the electrodes. The leads are then irradiated with an optical beam so as to melt the metal pieces of the electrodes for bonding of the leads to the circuit board.

Method for bonding lead of IC component with electrode

A method and apparatus is provided for forming bumps on a plurality of IC chips arranged in a checkered pattern on a wafer. The bumps are formed from bump bases fixed to each IC chip. A forming tool having a recessed part of a height that is greater than the height of the bump bases is used to deform the bump bases into bumps. The forming tool is pressed by an elevating driving device against the bump bases under pressure sufficient to deform a respective part of each of the bump bases secured to each IC chip into a shape corresponding to that of the recess defined by the forming tool.

Method for bump formation and its equipment

A chip type electronic component includes a main body having opposite first and second end surfaces and a lower surface defining a first plane. First and second electrode portions are respectively connected to the first and second end surfaces of the main body. Each of the first and second electrode portions includes a lower surface. Each lower surface of the first and second electrode portions includes a first planar face extending adjacent the main body in a second plane which is parallel to the first plane defined by the main body, and a second planar face extending adjacent the first planar face in a third plane which extends upwardly at an angle relative the second plane away from the main body. Accordingly, upon mounting of the chip type electronic component to a planar circuit board, a space is provided between the second planar face of each of the first and second electrode portions for accommodating solder materials.

Electrode structure of a chip type electronic component

A bonding method of semiconductor device by using a film carrier; A heat-resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by plating using the heat-resistive insulating layer as a mask; After transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.

Growing community of inventors

Hirakata, Japan

Yoshifumi Kitayama