The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2002

Filed:

Feb. 16, 2001
Applicant:
Inventors:

Kouhei Enchi, Osaka, JP;

Hiroyuki Yoshida, Kadoma, JP;

Yoshifumi Kitayama, Hirakata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; B05B 3/00 ;
U.S. Cl.
CPC ...
B05D 5/12 ; B05B 3/00 ;
Abstract

A method and a device for applying a sealant to an IC having bumps, which can solve a cobwebbing problem when a dispense nozzle is raised after the sealant has been applied and implement a productivity improvement; specifically, a method and a device for applying a sealant to an IC having bumps, wherein a dispense nozzle ( ) is raised in a first stage (E) at a low speed simultaneously with the stop of dispensing until the first stage (E) covers a specified height and then it is raised in a second stage (F) at a high seed. The above design, in which the dispense nozzle ( ) is raised in the first stage (E) at a low speed after the application of the sealant ( ) and the nozzle ( ) is then raised at a high speed and in a short time in the second stage (F), can positively break off the sealant ( ) without inducing cobwebbing and enhance productivity.


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