The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 24, 2007

Filed:

Jun. 02, 2004
Applicants:

Takahiro Yonezawa, Neyagawa, JP;

Ken Kobayashi, Hirakata, JP;

Mikio Hasegawa, Neyagawa, JP;

Hiroshi Nasu, Neyagawa, JP;

Makoto Imanishi, Hirakata, JP;

Katsuhiko Watanabe, Moriguchi, JP;

Inventors:

Takahiro Yonezawa, Neyagawa, JP;

Ken Kobayashi, Hirakata, JP;

Mikio Hasegawa, Neyagawa, JP;

Hiroshi Nasu, Neyagawa, JP;

Makoto Imanishi, Hirakata, JP;

Katsuhiko Watanabe, Moriguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an electronic component mounting apparatus, a vertical load and horizontal loads applied to an electronic component are detected by a load sensor that has piezoelectric elements provided in a stack in a mounting direction of the electronic component. Therefore, a size in a horizontal direction of the load sensor can be reduced, and a load applied to the electronic component can be detected at a neighborhood of a mounting position of the electronic component. Moreover, by comparing a position, in a two-dimensional space in which load values in an X-direction and Y-direction of the horizontal load serve as coordinate values, with a tolerance range in the two-dimensional space, a mounting failure can be detected from a deviation in the horizontal loads.


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