Schenectady, NY, United States of America

Son Van Nguyen

Average Co-Inventor Count = 4.1

ph-index = 23

Forward Citations = 3,534(Granted Patents)

Forward Citations (Not Self Cited) = 3,139(Sep 21, 2024)

DiyaCoin DiyaCoin 5.38 

Inventors with similar research interests:


Location History:

  • Rochester, MN (US) (1987)
  • Essex Junction, VT (US) (1989)
  • Dutchess County, NY (US) (1996 - 1997)
  • Williston, VT (US) (1993 - 1998)
  • Hopewell Junction, NY (US) (1995 - 2002)
  • San Jose, CA (US) (1998 - 2007)
  • Los Gatos, CA (US) (1999 - 2013)
  • Yorktown Heights, NY (US) (2006 - 2016)
  • Schnectady, NY (US) (2017)
  • Armonk, NY (US) (2020 - 2021)
  • Schenectady, NY (US) (2007 - 2024)


Years Active: 1987-2025

where 'Filed Patents' based on already Granted Patents

204 patents (USPTO):

Title: Son Van Nguyen: A Pioneer in Semiconductor Innovations

Introduction:

Son Van Nguyen, a resident of Schenectady, NY, is a prominent figure in the field of semiconductor devices. With an impressive portfolio of 175 patents, Nguyen has made significant contributions to the advancement of technology in this domain. This article will delve into his latest patents, career highlights, and collaborations, highlighting his remarkable achievements.

Latest Patents:

Nguyens recent patents include groundbreaking inventions in the field of nano-scale semiconductor devices. One notable patent is the "Air Gap Spacer Formation for Nano-Scale Semiconductor Devices". This patent describes a method for fabricating semiconductor devices containing air gap spacers that are integrated into the back-end-of-line (BEOL) or middle-of-line (MOL) layers of the devices. These spacers, formed by depositing a dielectric material using a pinch-off deposition process, offer enhanced performance and increased miniaturization possibilities.

Another noteworthy patent is the "Copper Interconnect Structure with Manganese Barrier Layer". This invention focuses on creating interconnect structures in dielectric materials with improved reliability and reduced capacitance. By forming a barrier layer on a copper-based interconnect structure through outdiffusion, this patent provides a solution for enhancing the longevity and electrical performance of such structures.

Career Highlights:

Son Van Nguyen has had a distinguished career working with renowned companies in the semiconductor industry. His expertise was valued at the International Business Machines Corporation (IBM), where he made remarkable contributions to the development of semiconductor technologies. Additionally, Nguyen contributed to the advancements in semiconductor storage technology during his time at Hitachi Global Storage Technologies Netherlands B.V.

Collaborations:

During his illustrious career, Nguyen has had the privilege of collaborating with several accomplished individuals in the field. Notably, he has worked alongside Alfred Grill, a remarkable scientist known for his expertise in materials research, and Deepika Priyadarshini, a prominent figure in semiconductor optimization techniques. Such collaborations have undoubtedly facilitated the exchange of knowledge and bolstered innovation in this field.

Conclusion:

Son Van Nguyen's numerous patents and contributions in the realm of nano-scale semiconductor devices have established him as an exceptional innovator in the industry. With an impressive career spanning multiple prestigious companies, Nguyen's work has made a significant impact on the field of semiconductor technology. His collaborations with top scientists have further enhanced his contributions, fostering a spirit of innovation that continues to drive advancements in this domain.

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