Average Co-Inventor Count = 4.13
ph-index = 23
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. International Business Machines Corporation (171 from 163,830 patents)
2. Applied Materials, Inc. (13 from 13,568 patents)
3. Hitachi Global Storage Technologies Netherlands B.v. (13 from 2,636 patents)
4. Globalfoundries Inc. (6 from 5,671 patents)
5. Adeia Semiconductor Bonding Technologies Inc. (5 from 1,851 patents)
6. Other (4 from 832,398 patents)
7. Sony Corporation (3 from 58,123 patents)
8. Lam Research Corporation (3 from 3,744 patents)
9. Siemens Aktiengesellschaft (2 from 29,985 patents)
10. Samsung Electronics Co., Ltd. (1 from 130,321 patents)
11. Advanced Micro Devices Corporation (1 from 12,831 patents)
12. Sony Electronics Inc (1 from 2,333 patents)
13. Chartered Semiconductor Manufacturing Ltd (corporation) (1 from 961 patents)
14. Sienens Aktiengesellschaft (1 from 1 patent)
207 patents:
1. 12446306 - Stacked field effect transistor structure with independent gate control between top and bottom gates
2. 12438039 - Air gap in beol interconnect
3. 12419079 - Field effect transistor with backside source/drain
4. 12387937 - Sam formulations and cleaning to promote quick depositions
5. 11942426 - Semiconductor structure having alternating selective metal and dielectric layers
6. 11908734 - Composite interconnect formation using graphene
7. 11804405 - Method of forming copper interconnect structure with manganese barrier layer
8. 11791398 - Nano multilayer carbon-rich low-k spacer
9. 11756786 - Forming high carbon content flowable dielectric film with low processing damage
10. 11658062 - Air gap spacer formation for nano-scale semiconductor devices
11. 11232983 - Copper interconnect structure with manganese barrier layer
12. 11186911 - Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same
13. 11177167 - Ultrathin multilayer metal alloy liner for nano Cu interconnects
14. 11171054 - Selective deposition with SAM for fully aligned via
15. 11164776 - Metallic interconnect structure