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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12387937 B1

PDFFull Text
Date of Patent:
Aug. 12, 2025

Filed:

Dec. 06, 2021

Sam formulations and cleaning to promote quick depositions

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Rudy J. Wojtecki, San Jose, CA (US);

Nicholas Anthony Lanzillo, Wynantskill, NY (US);

Prasad Bhosale, Albany, NY (US);

Son Nguyen, Schenectady, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Cantor Colburn LLP

L. Jeffrey Kelly

Primary Examiner:

Eliseo Ramos Feliciano

Assistant Examiner:

Brad A Knudson

Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/02 (2006.01); H01L 21/32 (2006.01); H01L 21/768 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C23C 16/02 (2006.01); C23C 16/04 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31 (2013.01); H01L 21/02068 (2013.01); H01L 21/02301 (2013.01); H01L 21/02636 (2013.01); H01L 21/02639 (2013.01); H01L 21/02642 (2013.01); H01L 21/32 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C23C 16/0227 (2013.01); C23C 16/04 (2013.01); C23C 16/56 (2013.01);
Abstract

Embodiments of the invention provide self-assembled monolayers (SAM) formulations and cleaning to promote quick depositions. A hydrogen-based plasma clean is performed on a structure, the structure including a metal layer and a dielectric layer. A self-assembled monolayers (SAM) solution is dispensed on the structure, the SAM solution including SAMs and a solvent, the SAMs being configured to assemble on the metal layer. The structure is rinsed with a rinse solution including the solvent.

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