Tokai, Japan

Shuji Eguchi

This inventor holds 44 USPTO granted patents and 2 EPO patents, primarily in Semiconductor Devices. Top assignees: Hitachi, Ltd., Renesas Technology Corp., Hitachi Cable, Inc.. Active years: 1986-2011.


% Patents Active = 70.5


Average Co-Inventor Count = 7.3

ph-index = 14

Forward Citations = 694(Granted Patents)


Location History:

  • Hitachi, JP (1986 - 1992)
  • Hitachi city, JP (1992)
  • Toukai, JP (2003)
  • Ibaraki-ken, JP (1997 - 2006)
  • Toukai-mura, JP (2000 - 2006)
  • Tokai-mura, JP (2000 - 2007)
  • Naka-gun, JP (2007)
  • Naka, JP (2006 - 2009)
  • Hitachinaka, JP (2009)
  • Kamagaya, JP (2008 - 2011)

Company Filing History:


Years Active: 1986-2011

Loading Chart...
Loading Chart...
Areas of Expertise:
Semiconductor Device
Control Device
Manufacturing Method
Vehicle Control
Semiconductor Module
Wiring Tape
Photoelectronic Device
Ball Grid Array
Packaging Structure
Laminate
Multilayer Printed Circuit Board
Stress Relieving Mechanism
44 patents (USPTO):Explore Patents

Title: Innovations by Shuji Eguchi: A Pioneer in Electronic Device Technology

Introduction

Shuji Eguchi, based in Tokai-mura, Japan, is a prominent inventor with an impressive portfolio of 44 patents. His work primarily revolves around the enhancement of electronic devices, focusing on improved heat dissipation and reliable circuit connections. Eguchi's inventions have significantly influenced the electronics industry, particularly in the development of modules and substrate technologies.

Latest Patents

Two of Eguchi's latest patents illustrate his innovative contributions. The first, titled "Control device and method of manufacturing thereof," describes a module that incorporates metallic terminal pins and a circuit board with electronic components. The unique feature of this invention is that both the circuit board and the electronic components are encapsulated with the same resin, enhancing protection and conductivity by uniting a metallic base with the module.

The second patent, concerning an "Electronic device," focuses on improving the heat dissipation properties of a multi-chip module (MCM) structure. It emphasizes maintaining the reliability of the connection between the interposer substrate and the motherboard. Eguchi uses a metal core base material that possesses excellent heat capacity and high thermal conductivity, which is crucial for effective thermal management in electronic devices.

Career Highlights

Eguchi has built his career in notable companies such as Hitachi, Ltd. and Renesas Technology Corporation. His roles at these leading technology firms have allowed him to apply and advance his inventive capabilities, leading to numerous innovations in electronic device engineering.

Collaborations

Throughout his career, Eguchi has collaborated with esteemed colleagues, including Akira Nagai and Masahiko Ogino. These partnerships have facilitated the exchange of ideas and fostered an environment of innovation, contributing to the successful development and patenting of groundbreaking technologies in the electronics field.

Conclusion

Shuji Eguchi’s inventive spirit and dedication to advancing technology are exemplified in his diverse patent portfolio. His advancements in electronic device technology not only enhance device performance but also pave the way for future innovations in the industry. As he continues to explore new horizons in his field, Eguchi remains a key figure in the landscape of modern electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to [email protected]
Loading…