The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Sep. 30, 2003
Shigeharu Tsunoda, Fujisawa, JP;
Junichi Saeki, Yokohama, JP;
Isamu Yoshida, Yokohama, JP;
Kazuya Ooji, Kamakura, JP;
Michiharu Honda, Yokohama, JP;
Makoto Kitano, Tsuchiura, JP;
Nae Yoneda, Ibaraki-ken, JP;
Shuji Eguchi, Ibaraki-ken, JP;
Kunihiko Nishi, Kokubunji, JP;
Ichiro Anjoh, Koganei, JP;
Kenichi Otsuka, Tokyo, JP;
Shigeharu Tsunoda, Fujisawa, JP;
Junichi Saeki, Yokohama, JP;
Isamu Yoshida, Yokohama, JP;
Kazuya Ooji, Kamakura, JP;
Michiharu Honda, Yokohama, JP;
Makoto Kitano, Tsuchiura, JP;
Nae Yoneda, Ibaraki-ken, JP;
Shuji Eguchi, Ibaraki-ken, JP;
Kunihiko Nishi, Kokubunji, JP;
Ichiro Anjoh, Koganei, JP;
Kenichi Otsuka, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.