Company Filing History:

12 out of 42,485

Hitachi, Ltd.

patents

1 out of 3,781

Renesas Technology Corp.

patents

Years Active: 1993-2005

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6861294 - Semiconductor devices and methods of making the devices (2005-03-01),

2. 6686226 - Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame (2004-02-03),

3. 6114192 - Method of manufacturing a semiconductor device having a ball grid array (2000-09-05),

4. 5914531 - Semiconductor device having a ball grid array package structure using a (1999-06-22),

5. 5608265 - Encapsulated semiconductor device package having holes for electrically (1997-03-04),

6. 5569960 - Electronic component, electronic component assembly and electronic (1996-10-29),

7. 5539250 - Plastic-molded-type semiconductor device (1996-07-23),

8. 5357139 - Plastic encapsulated semiconductor device and lead frame (1994-10-18),

9. 5347429 - Plastic-molded-type semiconductor device (1994-09-13),

10. 5296737 - Semiconductor device with a plurality of face to face chips (1994-03-22),

11. 5295045 - Plastic-molded-type semiconductor device and producing method therefor (1994-03-15),

12. 5256903 - Plastic encapsulated semiconductor device (1993-10-26),

13. 5194935 - Plastic encapsulated semiconductor device and structure for mounting the (1993-03-16),

Title: Nae Yoneda: Pioneering Innovations in Semiconductor Technology

Introduction: Nae Yoneda, a trailblazing inventor based in Ibaraki-ken, Japan, has been at the forefront of technological advancements with her dedication to pushing the boundaries of what is possible through her numerous inventions. With a total of 13 patents to her name, Nae Yoneda is a true visionary in the world of technology.

Latest Patents: Among her latest patents is the development of semiconductor devices and methods of making the devices, particularly focusing on a semiconductor plastic package. This innovative package structure and method for making a BGA package involve a resin-sealed BGA package where a supporting frame securely holds semiconductor parts, such as an IC chip, a circuit board, or a circuit film, sealed with resin using a specialized mold structure. The method of manufacturing a semiconductor device, specifically a ball grid array package structure using a supporting frame, showcases Nae Yoneda's expertise and ingenuity in the field.

Career Highlights: Nae Yoneda has made significant contributions to the technological landscape through her work at prominent companies such as Hitachi, Ltd. and Renesas Technology Corp. Her innovative approach to semiconductor technology has led to groundbreaking advancements in the industry, solidifying her reputation as a leading inventor in her field.

Collaborations: Throughout her career, Nae Yoneda has collaborated with esteemed colleagues such as Makoto Kitano and Akihiro Yaguchi. These partnerships have not only enriched her work but have also resulted in the development of cutting-edge technologies that have had a lasting impact on the industry.

Conclusion: Nae Yoneda's relentless pursuit of innovation and her unwavering commitment to technology have positioned her as a true trailblazer in the world of semiconductor technology. Her groundbreaking inventions and patents stand as a testament to her creativity, expertise, and dedication to shaping the future of technology.

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Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.