The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 1994
Filed:
Sep. 08, 1993
Applicant:
Inventors:
Akihiro Yaguchi, Ibaraki, JP;
Asao Nishimura, Ushiku, JP;
Makoto Kitano, Tsuchiura, JP;
Ryuji Kohno, Ibaraki, JP;
Nae Yoneda, Ibaraki, JP;
Ichiro Anjoh, Koganei, JP;
Gen Murakami, Tama, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257666 ; 257668 ; 257669 ; 257670 ; 257675 ; 257676 ;
Abstract
In a package for DRAM, plastic is included between the common signal inner leads (bus bar inner leads) and insulating films arranged in the central part of a semiconductor chip. Thus, the deformation of plastic at the upper edge of the common signal inner leads is reduced and no great stress is generated at this portion. Accordingly, plastic cracking can be prevented.