The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 1993
Filed:
Nov. 26, 1991
Maya Obata, Ishioka, JP;
Asao Nishimura, Ushiku, JP;
Makoto Kitano, Tsuchiura, JP;
Akihiro Yaguchi, Niihari, JP;
Ryuji Kohno, Niihari, JP;
Nae Yoneda, Niihari, JP;
Ichiro Anjoh, Koganei, JP;
Gen Murakami, Tama, JP;
Hitachi Ltd., Tokyo, JP;
Abstract
A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.