The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
May. 07, 2004
Shuji Eguchi, Tokai-mura, JP;
Akira Nagai, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Takumi Ueno, Mito, JP;
Toshiya Satoh, Kanasagou-machi, JP;
Masahiko Ogino, Hitachi, JP;
Asao Nishimura, Kokubunji, JP;
Ichiro Anjo, Koganei, JP;
Hideki Tanaka, Sagamihara, JP;
Shuji Eguchi, Tokai-mura, JP;
Akira Nagai, Hitachi, JP;
Haruo Akahoshi, Hitachi, JP;
Takumi Ueno, Mito, JP;
Toshiya Satoh, Kanasagou-machi, JP;
Masahiko Ogino, Hitachi, JP;
Asao Nishimura, Kokubunji, JP;
Ichiro Anjo, Koganei, JP;
Hideki Tanaka, Sagamihara, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with a single heat spread plate, the whole space around the semiconductor chips thus sandwiched between the wiring board and the heat spread plate is filled with resin. By so doing, the semiconductor chips are interconnected through the resin, so that even if a stress is exerted on any of the chips, it is dispersed and therefore it is possible to diminish the occurrence of cracks in the chips and the heat spread plate caused by stress concentration. Besides, since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.