The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2009
Filed:
Jun. 20, 2003
Takehide Yokozuka, Yokohama, JP;
Masahide Harada, Yokohama, JP;
Shiro Yamashita, Yokohama, JP;
Kaoru Uchiyama, Hitachinaka, JP;
Shuji Eguchi, Hitachinaka, JP;
Masahiko Asano, Hitachinaka, JP;
Koji Sato, Hitachinaka, JP;
Takehide Yokozuka, Yokohama, JP;
Masahide Harada, Yokohama, JP;
Shiro Yamashita, Yokohama, JP;
Kaoru Uchiyama, Hitachinaka, JP;
Shuji Eguchi, Hitachinaka, JP;
Masahiko Asano, Hitachinaka, JP;
Koji Sato, Hitachinaka, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.