Hitachi, Ltd.

Renesas Technology Corp.

Other

Hitachi Cable, Inc.

Hitachi Car Engineering Co., Ltd.

U.S. Philips Corporation

Hitachi Ulsi Systems Co., Ltd.

Akita Electronics Systems Co., Ltd.

Shuji Eguchi

Akira Nagai

Masahiko Ogino

Ichiro Anjoh

Asao Nishimura

Makoto Kitano

Hiroyoshi Kokaku

Masanori Segawa

Toshiaki Ishii

Chuichi Miyazaki

Takumi Ueno

Mamoru Mita

Hideki Tanaka

Kunihiro Tsubosaki

Ichiro Anjo

Nobutake Tsuyuno

Masahiko Asano

Kunihiko Nishi

Toshiya Satoh

Haruo Akahoshi

Naotaka Tanaka

Isamu Yoshida

Kaoru Uchiyama

Hideki Asano

Norio Okabe

Noriaki Taketani

Junichi Saeki

Shigeharu Tsunoda

Yukiharu Akiyama

Tomoaki Kudaishi

Seikichi Tanno

Nae Yoneda

Michiharu Honda

Hiroshi Koyama

Kunito Nakatsuru

Kenichi Otsuka

Takehiro Ohnishi

Noriou Shimada

Rie Hattori

Kazuya Ooji

Akihiro Yaguchi

Ryuji Kohno

Masatsugu Ogata

Makoto Morishima

Tetsuo Kumazawa

Masanori Shibamoto

Yasuo Akutsu

Toshiak Ishii

Akio Takahashi

Masahiko Ibamoto

Masahide Harada

Tomiya Abe

Koji Sato

Takuya Mayuzumi

Motoyo Wajima

Takao Miwa

Masahiro Sasaki

Shiro Yamashita

Hiroshi Naka

Johan George Kloosterboer

Junji Mukai

Yoshiaki Okabe

Tadanori Segawa

Shoichi Takahashi

Takehide Yokozuka

Toshimasa Miura

Kiyoomi Kadoya

Dirk J Broer

Ichirou Anjou

Ryo Moteki

Akira Endo

Akio Hasebe

Satoshi Nakamura

Ryosuke Kimoto

Hiroatsu Tokuda

Teruo Kitamura

Hiromu Terao

Masato Shimura

Masanori Nemoto

Yuuetsu Takuma

Yukio Shimazaki

Yasuhide Sugawara

Masnori Shibamoto

Mutsumi Watanabe

Ogino Masahiko

Ryou Moteki

Kenji Akeyama

Tuneo Narusawa

Yoshimitsu Mihara

Yukihiko Takada

A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

Control device and method of manufacturing thereof

In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

Electronic device

A device for controlling a vehiclecomprising a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon, and plugsandprovided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of said housing; wherein the plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

Device for controlling a vehicle

An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150&#xb0; C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.

A device for controlling a vehiclehas a housing, a rectangular printed circuit board inside of the housing and a control circuit thereon. Plugs are provided along one side of the rectangular printed circuit board to transfer signals between the inside and the outside of the housing. The plugs have plug pins that are electrically connected to the printed circuit board within the housing.

Semiconductor devices,-semiconductor wafers, and semiconductor modules are provided: wherein the semiconductor device has a small warp; damages at chip edge and cracks in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor devicecomprising: a semiconductor chipa porous stress relaxing layerprovided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layerprovided on the stress relaxing layer and connected to the electrodes; and external terminalsprovided on the circuit layer; wherein an organic protecting filmis formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chipand the protecting filmare exposed outside on a same plane.

Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200&#x2013;250&#xb0; C.).

Circuit tape having adhesive film semiconductor device and a method for manufacturing the same

A semiconductor device includes a semiconductor chip formed with connection terminals, an elastic structure interposed between a main surface of the chip and a wiring substrate formed with wirings connected at first ends thereof to the connection terminals, and bump electrodes connected to the other ends of the wirings. The connection terminals may be at a center part or in peripheral part(s) of the chip main surface and both the elastic structure and wiring substrate are not provided at locations of connection terminals. A resin body seals at least the connection terminals and the exposed first ends of wirings (leads). In a scheme in which the connection terminals are located in a peripheral part of the chip main surface, the wiring substrate protrudes beyond the chip boundary where the connection terminals are arranged, and the resin body shape is restricted by the protruding part of the wiring substrate.

Semiconductor device and manufacturing method thereof

In a semiconductor device having a three-layered buffer layer comprising core layerhaving interconnected foams such as a three-dimensional reticular structure and adhesive layersprovided on both sides of the core layer as a stress buffer layer between semiconductor chipand wiringto lessen a thermal stress generated between the semiconductor device and the package substrate, where a thickness ratio of the core layerto total buffer layer is at least 0.2, the production process can be simplified by using such a buffer layer, thereby improving the mass production capacity and enhancing the package reliability.

Wiring tape for semiconductor device including a buffer layer having interconnected foams

A device for controlling a vehiclehaving a housing, a rectangular printed circuit boardwhich is fixed to the inside of the housing and has a control circuit thereon. Plugsandare provided along one side of the rectangular printed circuit boardto transfer signals between the inside and the outside of the housing. The plugsandrespectively contain plug pins and the plug pinsare electrically connected to the printed circuit boardvia bonding wiresinside the housing

In a multi chip module of a structure wherein a plurality of bare or packaged semiconductor chips are mounted on a single wiring board and upper surfaces of the semiconductor chips are covered with a single heat spread plate, the whole space around the semiconductor chips thus sandwiched between the wiring board and the heat spread plate is filled with resin. By so doing, the semiconductor chips are interconnected through the resin, so that even if a stress is exerted on any of the chips, it is dispersed and therefore it is possible to diminish the occurrence of cracks in the chips and the heat spread plate caused by stress concentration. Besides, since the semiconductor chips and the heat spread plate are bonded together with resin, even if there are variations in size of the chips, both can be bonded easily. Further, the bonding of all the chips and the heat spread plate can be done in a single process.

Semiconductor module and mounting method for same

Semiconductor devices, semiconductor wafers, and semiconductor modules are provided, wherein: the semiconductor device has a small warp; damage at the chip edge and cracks occurring in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor includes a semiconductor chip; a porous stress relaxing layerprovided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layerprovided on the stress relaxing layer and connected to the electrodes; and external terminalsprovided on the circuit layer; wherein an organic protecting filmis formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip, and the protecting filmare exposed outside on the same plane.

A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.

Semiconductor devices and methods of making the devices

A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250&deg; C.).

Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same

Growing community of inventors

Tokai-mura, Japan

Shuji Eguchi