Shinji Okada

This inventor holds 9 USPTO granted patents. Top assignees: Tokyo Electron Limited, Intel Corporation. Active years: 2010-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Okada. Retrieved from https://idiyas.com/inventor/shinji-okada-4vm8wzr4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 9

% Patents Active = 88.9

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 32(Granted Patents)

Location History:

Koshi-Machi, JP (2010)
Koshi, JP (2010 - 2015)
Kumamoto, JP (2014 - 2018)

Company Filing History:

9 out of 10,947

Tokyo Electron Limited

where one patent can have more than one assignee

Years Active: 2010-2018

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10008419 - Separation method, computer storage medium, and separation system (2018-06-26),

2. 9484236 - Joining method and joining system (2016-11-01),

3. 9463612 - Joining method and joining system (2016-10-11),

4. 8992687 - Substrate processing apparatus, method for processing substrate, and storage medium (2015-03-31),

5. 8899289 - Joint method, joint apparatus and joint system (2014-12-02),

6. 7947215 - Heat treatment apparatus, heat treatment method, and recording medium storing computer program carrying out the same (2011-05-24),

7. 7745347 - Heat treatment apparatus, heat treatment method, and recording medium storing computer program carrying out the same (2010-06-29),

8. 7661894 - Coating and developing apparatus, and coating and developing method (2010-02-16),

9. 7640885 - Liquid processing method and liquid processing apparatus (2010-01-05),

Title: The Innovative Contributions of Shinji Okada

Introduction

Shinji Okada is a prominent inventor based in Koshi, Japan. He has made significant contributions to the field of technology, particularly in the area of wafer processing. With a total of 9 patents to his name, Okada's work has had a substantial impact on the industry.

Latest Patents

Okada's latest patents include a separation method, computer storage medium, and separation system. This innovative separation method involves separating a superposed wafer into a processing target wafer and a supporting wafer while applying heat. The process includes removing an adhesive on the joint surface of the processing target wafer by supplying an organic solvent. Additionally, an oxide film formed on a predetermined pattern on the joint surface is removed using acetic acid. The joint surface is then inspected, and based on the inspection results, the adhesive and oxide film are further removed as necessary. Another notable patent is his joining method and joining system, which outlines a process for joining a target substrate and a support substrate. This method includes an adhesive coating operation, an adhesive removing operation, and a joining operation, ensuring a precise and effective joining process.

Career Highlights

Throughout his career, Shinji Okada has worked with notable companies such as Tokyo Electron Limited and Intel Corporation. His experience in these leading technology firms has allowed him to refine his skills and contribute to groundbreaking advancements in the field.

Collaborations

Okada has collaborated with esteemed colleagues, including Masatoshi Deguchi and Masatoshi Shiraishi. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Shinji Okada's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative methods in wafer processing continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]