The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Sep. 13, 2012
Applicants:

Masatoshi Deguchi, Kumamoto, JP;

Masatoshi Shiraishi, Kumamoto, JP;

Shinji Okada, Kumamoto, JP;

Inventors:

Masatoshi Deguchi, Kumamoto, JP;

Masatoshi Shiraishi, Kumamoto, JP;

Shinji Okada, Kumamoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); G05G 15/00 (2006.01); B23K 31/00 (2006.01); H01L 21/30 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/18 (2006.01); B32B 38/00 (2006.01); H01L 21/683 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6715 (2013.01); H01L 21/68707 (2013.01); B32B 2309/02 (2013.01); H01L 21/67109 (2013.01); B32B 2457/14 (2013.01); H01L 21/68742 (2013.01); H01L 21/187 (2013.01); B32B 2038/1891 (2013.01); B32B 2457/20 (2013.01); H01L 21/67126 (2013.01); B32B 38/0036 (2013.01); B32B 2309/62 (2013.01); H01L 21/6719 (2013.01); H01L 21/6838 (2013.01);
Abstract

When joining a processing target substrate and a supporting substrate together by suction-holding the processing substrate and the supporting substrate respectively on a first holding unit and a second holding unit arranged to face each other and pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, the present invention preheats at least the processing target substrate before suction-holding the processing target substrate on the first holding unit to suppress generation of particles when joining the processing target substrate and the supporting substrate together so as to properly perform the joining of the processing target substrate and the supporting substrate.


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