The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 26, 2011
Applicants:

Hiroyuki Kudoh, Koshi, JP;

Hideto Mori, Koshi, JP;

Shinji Okada, Koshi, JP;

Toyohisa Tsuruda, Koshi, JP;

Inventors:

Hiroyuki Kudoh, Koshi, JP;

Hideto Mori, Koshi, JP;

Shinji Okada, Koshi, JP;

Toyohisa Tsuruda, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/52 (2006.01); C23C 16/458 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01);
Abstract

Processing gas is supplied from the central upper part of a processing chamber to a wafer on a mounting board, while the processing chamber is exhausted from processing gas exhaust passages at areas outside of the wafer. In addition, purge gas is supplied from purge gas supply passages to a buffer chamber formed between the peripheral part of a container main body and that of a cover body. The supplied flow-rate of the processing gas is made less than the exhaust flow-rate in the processing gas exhaust passages. Accordingly, the purge gas in the buffer chamber is drawn into the processing chamber via a purge gas supply hole formed of a gap between the container main body and the cover body due to a negative pressure inside the processing chamber caused by a difference between the flow rates.


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