The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2010

Filed:

Jun. 21, 2007
Applicants:

Tsunenaga Nakashima, Koshi-Machi, JP;

Kenji Urata, Koshi-Machi, JP;

Shinji Okada, Koshi-Machi, JP;

Nobuaki Matsuoka, Koshi-Machi, JP;

Inventors:

Tsunenaga Nakashima, Koshi-Machi, JP;

Kenji Urata, Koshi-Machi, JP;

Shinji Okada, Koshi-Machi, JP;

Nobuaki Matsuoka, Koshi-Machi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05B 15/02 (2006.01); B05B 3/00 (2006.01); B05C 11/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a nozzle unitequipped with processing-liquid nozzlesA toJ, an air layerand a solvent layerfor processing liquid are successively formed outside a processing-liquid layerincluded in the tip of each nozzleA (B toJ). Next, the solvent layerin the nozzleA is thrown out into a drain partof a standby unitand subsequently, the processing liquid is supplied from the nozzleA to the surface of a wafer W, performing a coating process. After completing the coating process, the processing liquid remaining in the nozzleA is sucked and continuously, respective tips of the nozzlesA toJ are dipped into respective solvents in solvent reservoirA toJ, respectively. From this state, by sucking in the nozzleA, there are newly formed, outside the processing layerin the tip of the nozzleA, an air layerand a solvent layerThus, in supplying a substrate, such as semiconductor wafer, with a processing liquid by use of a nozzle unit having a plurality of processing-liquid nozzles integrated, it is possible to prevent dryness of the processing liquids in the respective nozzles while preventing the nozzle unit from being large-sized.


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