Tokyo, Japan

Ryuichi Ishii

This inventor holds 32 USPTO granted patents and 3 published patent applications and 4 EPO patents, primarily in Semiconductor Devices. Top assignees: Mitsubishi Electric Corporation, Kabushiki Kaisha Toshiba, Action Click Co., Ltd.. Active years: 1990-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ryuichi Ishii. Retrieved from https://idiyas.com/inventor/ryuichi-ishii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 78.1

 

Average Co-Inventor Count = 2.8

ph-index = 6

Forward Citations = 181(Granted Patents)


Location History:

  • Kanagawa-ken, JP (1998)
  • Toyko, JP (2001)
  • Tokyo-To, JP (2004)
  • Yokohama, JP (1996 - 2009)
  • Edogawa-ku, JP (2007 - 2009)
  • Chiyoda-ku, JP (2014)
  • Tokyo, JP (1990 - 2023)

Company Filing History:


Years Active: 1990-2026

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Areas of Expertise:
Resin-Sealed Device
Power Semiconductor
Thermal Cracking
Power Module
Electric Power Converter
Heat-Resisting Steel
Steam Turbine
Manufacturing Method
Reactor
Turbine Rotor
Crop Yield
32 patents (USPTO):Explore Patents

Title: **Ryuichi Ishii: Innovator in Power Semiconductor Technology**

Introduction

Ryuichi Ishii is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of power semiconductor devices. With a remarkable portfolio of 27 patents, Ishii has established himself as a leader in the innovation of semiconductor technology, particularly in the manufacturing processes that enhance device performance and reliability.

Latest Patents

Ishii's latest patents illustrate his commitment to advancing semiconductor technology. One notable patent is a power semiconductor device and method for its manufacturing. This innovative design consists of multiple power modules with control terminals mounted on a heat sink. The construction features two protruding portions that engage with specially designed recessed portions on the heat sink, facilitating improved thermal management.

Another recent patent addresses the issue of thermal cracking in semiconductor devices. In this design, a heat spreader is utilized alongside a semiconductor element and lead frames, uniquely joined by several joining members. The specific angling of these components is engineered to optimize performance and thermal resistance, ensuring longevity and reliability during operation.

Career Highlights

Throughout his career, Ryuichi Ishii has worked with leading technology companies such as Mitsubishi Electric Corporation and Toshiba Corporation. At these companies, he has played a vital role in advancing semiconductor technology, paving the way for innovations that have had significant impacts on various electronic applications.

Collaborations

Collaboration has been a cornerstone of Ishii's work, with notable coworkers including Yoichi Tsuda and Masayuki Yamada. These partnerships have fostered an environment of innovation and creativity, allowing for the exchange of ideas that have ultimately contributed to the development of cutting-edge semiconductor technologies.

Conclusion

Ryuichi Ishii’s impressive array of patents and his successful career at prestigious companies highlight his stature as a leading figure in the field of semiconductor technology. His innovative spirit continues to drive advancements that not only enhance the efficiency of power devices but also contribute to the broader electronics industry. With his ongoing work, Ishii remains a vital contributor to future innovations in the realm of power semiconductors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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