The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2020

Filed:

Aug. 28, 2017
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, Tokyo, JP;

Inventors:

Noriyuki Besshi, Tokyo, JP;

Ryuichi Ishii, Tokyo, JP;

Masaru Fuku, Tokyo, JP;

Yuji Fujimoto, Tokyo, JP;

Yusuke Hirata, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Chiyoda-Ku, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/48 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 27/07 (2006.01); H01L 29/10 (2006.01); H01L 29/739 (2006.01); H01L 29/861 (2006.01);
U.S. Cl.
CPC ...
H01L 23/64 (2013.01); H01L 23/48 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 25/115 (2013.01); H01L 25/18 (2013.01); H01L 27/0711 (2013.01); H01L 29/1095 (2013.01); H01L 29/7393 (2013.01); H01L 29/861 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01);
Abstract

Provided is a power semiconductor device including a signal terminal and a power semiconductor element. The power semiconductor element is arranged on a substrate. The signal terminal includes a main body portion and a joint portion, and a part of the signal terminal is held by a terminal block. The joint portion includes a distal end portion and a base portion. The distal end portion includes a pad portion that is exposed from the terminal block and connected to a signal line. The base portion includes a thin portion in which a thickness in a vertical direction is set to be smaller than that of the pad portion. The thin portion has an upper surface that is formed at a position lower than an upper surface of the pad portion and is covered with a resin material forming the terminal block.


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