Semiconductor device and manufacturing method therefor

Abstract

This semiconductor device includes a first dummy terminal extending from a second conductor toward one side in a first direction, a second dummy terminal extending from a fourth conductor toward another side in the first direction, and a third dummy terminal extending from a third conductor through between a third conductive plate and a fourth conductive plate toward one side in a second direction, and connected to a second AC terminal. In a state in which ends of the first dummy terminal, the second dummy terminal, first control terminals, second control terminals, second AC terminals, first AC terminals, N terminals, and P terminals are exposed, the first conductive plate, a second conductive plate, the third conductive plate, the fourth conductive plate, first switching elements, second switching elements, a first conductor, the second conductor, the third conductor, and the fourth conductor are sealed by a resin member.