The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2019
Filed:
May. 12, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Ryuichi Ishii, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/293 (2013.01); H01L 23/3107 (2013.01); H01L 23/3121 (2013.01); H01L 23/49524 (2013.01); H01L 23/49548 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/40245 (2013.01); H01L 2924/181 (2013.01);
Abstract
Freedom of layout is increased, and a small, low-priced molded resin-sealed power semiconductor device is obtained. A molded resin-sealed power semiconductor device includes a power semiconductor element, a lead frame having a thick portion on which the power semiconductor element is mounted and a thin portion thinner than the thick portion, an inner lead that electrically connects the power semiconductor element and lead frame, and a molded resin that seals the power semiconductor element, lead frame, and inner lead.