Ruth Amy Brain

This inventor holds 39 USPTO granted patents and 7 published patent applications and 3 EPO patents, primarily in Integrated Circuit Design. Top assignees: Intel Corporation, California Institute of Technology. Active years: 1998-2025.

USPTO Granted Patents = 39 (Patent Applications = 7)

% Patents Active = 92.3

EPO Patents = 3 (Patent Applications = 5)

Average Co-Inventor Count = 2.9

ph-index = 8

Forward Citations = 199(Granted Patents)

Location History:

Garthersburg, MD (US) (1998)
Portland, OR (US) (1998 - 2023)

Company Filing History:

California Institute of Technology

patents

Years Active: 1998-2025

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Areas of Expertise:

Integrated Circuits

Via Contact Patterning

Metal Reflow

Decoupled Via Fill

Ferroelectric Capacitors

Power Shared Cell Architecture

Low-K Dielectrics

Conductive Vias

Hardmask Patterning

CMOS Technology

Logic Formation

Embedded SRAM

39 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12308284 - Plug and trench architectures for integrated circuits and methods of manufacture (2025-05-20),

2. 11764219 - Metal space centered standard cell architecture to enable higher cell density (2023-09-19),

3. 11723188 - Replacement metal COB integration process for embedded DRAM (2023-08-08),

4. 11652045 - Via contact patterning method to increase edge placement error margin (2023-05-16),

5. 11417567 - Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom (2022-08-16),

6. 11322504 - Ferroelectric-capacitor integration using novel multi-metal-level interconnect with replaced dielectric for ultra-dense embedded SRAM in state-of-the-art CMOS technology (2022-05-03),

7. 11211324 - Via contact patterning method to increase edge placement error margin (2021-12-28),

8. 11171043 - Plug and trench architectures for integrated circuits and methods of manufacture (2021-11-09),

9. 11145541 - Conductive via and metal line end fabrication and structures resulting therefrom (2021-10-12),

10. 11068640 - Power shared cell architecture (2021-07-20),

11. 10943817 - Etch-stop layer topography for advanced integrated circuit structure fabrication (2021-03-09),

12. 10903114 - Decoupled via fill (2021-01-26),

13. 10811595 - Techniques for forming logic including integrated spin-transfer torque magnetoresistive random-access memory (2020-10-20),

14. 10796951 - Etch-stop layer topography for advanced integrated circuit structure fabrication (2020-10-06),

15. 10672650 - Via blocking layer (2020-06-02),

Title: Ruth Amy Brain - Pioneering Inventor from Portland

Introduction: Ruth Amy Brain is a trailblazing inventor based in Portland, Oregon, known for her innovative contributions to various fields.

Latest Patents: Ruth Amy Brain holds several patents in the areas of sustainable energy solutions, eco-friendly packaging, and advanced medical devices.

Career Highlights: With a background in engineering and a passion for sustainability, Ruth Amy Brain has led groundbreaking projects that have revolutionized the way we approach environmental challenges.

Collaborations: Throughout her career, Ruth Amy Brain has collaborated with leading research institutions, universities, and companies to bring her inventions to life and make a positive impact on society.

Conclusion: Ruth Amy Brain's dedication to innovation and sustainability continues to inspire the next generation of inventors and shape a brighter future for all.