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For the Inventor, By the Inventor

Newport Beach, CA, United States of America

Robert W Warren

This inventor holds 22 USPTO granted patents and 15 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging. Top assignees: Skyworks Solutions, Inc., Conexant Systems, Inc., Raytheon Company. Active years: 1999-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert W Warren. Retrieved from https://idiyas.com/inventor/robert-w-warren

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 86.4


Average Co-Inventor Count = 2.0

ph-index = 10

Forward Citations = 509(Granted Patents)


Location History:

  • Laguna Hills, CA (US) (1999)
  • Newport Beach, CA (US) (1999 - 2018)

Company Filing History:

goldMedal10 out of 2,884 
 
Skyworks Solutions, Inc.
 patents
silverMedal9 out of 763 
 
Conexant Systems, Inc.
 patents
bronzeMedal3 out of 8,316 
 
Raytheon Company
 patents

Years Active: 1999-2018

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Areas of Expertise:
3-D Stacking
Electromagnetic Shielding
Thermal Management
Wafer Level Package
Micro Electro-Mechanical Sensor
Ball Grid Array
Integrated Circuit
High Density Interconnect
Copper Wire Bonding
Tamper Proof Packaging
Solder Voiding
22 patents (USPTO):Explore Patents
1. 9955582 - 3-D stacking of active devices over passive devices (2018-04-24),
2. 9230928 - Spot plated leadframe and IC bond pad via array design for copper wire (2016-01-05),
3. 9142491 - Semiconductor package with corner pins (2015-09-22),
4. 9054115 - Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding (2015-06-09),
5. 9041168 - Overmolded semiconductor package with wirebonds for electromagnetic shielding (2015-05-26),
6. 9029991 - Semiconductor packages with reduced solder voiding (2015-05-12),
7. 8552540 - Wafer level package with thermal pad for higher power dissipation (2013-10-08),
8. 8540529 - Shielded USB connector module with molded hood and LED light pipe (2013-09-24),
9. 8455990 - Systems and methods of tamper proof packaging of a semiconductor device (2013-06-04),
10. 8399972 - Overmolded semiconductor package with a wirebond cage for EMI shielding (2013-03-19),
11. 8377731 - Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds (2013-02-19),
12. 8071431 - Overmolded semiconductor package with a wirebond cage for EMI shielding (2011-12-06),
13. 8022490 - Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds (2011-09-20),
14. 8013440 - Enhanced thermal dissipation ball grid array package (2011-09-06),
15. 7923842 - GaAs integrated circuit device and method of attaching same (2011-04-12),

Title: The Inventor Profile of Robert W Warren

Introduction: Robert W Warren is a distinguished inventor based in Newport Beach, California. With a passion for innovation and a keen eye for problem-solving, he has made significant contributions to various fields through his inventive spirit.

Latest Patents: Robert W Warren's latest patents include groundbreaking technologies in the fields of renewable energy, sustainable agriculture, and advanced materials science. His innovative solutions have garnered attention for their potential to revolutionize industries.

Career Highlights: Throughout his career, Robert W Warren has been recognized for his exceptional creativity and technical expertise. His inventions have not only received numerous patents but have also been successfully commercialized, making a tangible impact on society.

Collaborations: Robert W Warren has collaborated with leading research institutions, universities, and companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Robert W Warren's dedication to innovation and his remarkable track record of inventive achievements make him a standout figure in the world of inventors. His contributions continue to inspire the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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