The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2018
Filed:
Apr. 23, 2008
Mark A. Kuhlman, Laguna Niguel, CA (US);
Anthony James Lobianco, Irvine, CA (US);
Thomas Noll, Sandown, NH (US);
Robert W. Warren, Newport Beach, CA (US);
Howard E. Chen, Anaheim, CA (US);
Mark A. Kuhlman, Laguna Niguel, CA (US);
Anthony James LoBianco, Irvine, CA (US);
Thomas Noll, Sandown, NH (US);
Robert W. Warren, Newport Beach, CA (US);
Howard E. Chen, Anaheim, CA (US);
Skyworks Solutions, Inc., Woburn, MA (US);
Abstract
Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.